MX66UW1G45GXDI00-T

Manufacturer

MXIC(Macronix)

MFR.Part #

MX66UW1G45GXDI00-T

JLCPCB Part #

C22390012

Package

BGA-24

Description

NOR Flash Serial NOR 1.8V 1Gbit x8 I/O BGA-24 RWW

EasyEDA Libraries

PCB Footprint or Symbol

ECCN

-

Datasheet

Download

Source

JLCPCB

Assembly Type

SMT Assembly

A PCB assembly fixture is needed to protect and support this part during the assembly process.

PCBA Type

Economic and Standard

MSL Level

Moisture Sensitivity Level (MSL) ratings range from 1 to 6, with MSL 6 being the most sensitive. Normally,components with MSL ratings of 5 or higher require baking to prevent damage from absorbed moisture during reflow soldering. Learn More>

MSL 3

X-ray Inspection

In order to ensure the soldering quality, X-ray inspection is required for components, like BGA, QFN, or other lead-less package types, whose soldering joints are hidden after assembly.

Required