SPC5775BDK3MME2

Manufacturer

NXP Semicon

MFR.Part #

SPC5775BDK3MME2

JLCPCB Part #

C1339747

Package

MAPBGA-416

Description

4MB 3V~5.5V 512KB 220MHz FLASH 293 MAPBGA-416 Microcontrollers (MCU/MPU/SOC) ROHS

EasyEDA Libraries

PCB Footprint or Symbol

ECCN

5A992C

Datasheet

Download

Source

JLCPCB

Assembly Type

SMT Assembly

A PCB assembly fixture is needed to protect and support this part during the assembly process.

PCBA Type

Standard Only

Due to limits in package (0201), temperature and other certain conditions, this part is only available for Standard PCBA service.

MSL Level

Moisture Sensitivity Level (MSL) ratings range from 1 to 6, with MSL 6 being the most sensitive. Normally,components with MSL ratings of 5 or higher require baking to prevent damage from absorbed moisture during reflow soldering. Learn More>

MSL 3

X-ray Inspection

In order to ensure the soldering quality, X-ray inspection is required for components, like BGA, QFN, or other lead-less package types, whose soldering joints are hidden after assembly.

Required