JLCPCB SMT Parts Library & Component Sourcing
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NAND FLASH
(2027)
- Manufacturer
- Alliance Memory
- ATO SOLUTION Co ., LTD
- ATP Electronics, Inc.
- Creat Storage World
- Delkin Devices, Inc.
- Dosilicon
- Flexxon
- FORESEE
- FUDAN MICRO
- GigaDevice Semicon Beijing
- Greenliant
- HeYangTek
- Holtek Semicon
- ICMAX
- Infineon Technologies
- Infineon/Cypress Semicon
- Insignis Technology Corporation
- ISSI(Integrated Silicon Solution)
- Kingston Technology
- KIOXIA
- PackageType
- 48-TSOP
- 48-TSOP I
- 63-VFBGA (10.5x13)
- 63-VFBGA (9x11)
- 8-WSON (8x6)
- BGA
- BGA-100(14x18)
- BGA-153(11.5x13)
- BGA-153(11.5X13)
- BGA-162
- BGA-162(8x10.5)
- BGA-24
- BGA-24(6x8)
- BGA-48
- BGA-63
- BGA-63(11x9)
- BGA-63(9x11)
- BGA-67(6.5x8)
- CSPBGA-24(6x8)
- Die
- Block Erase Time (tBE)
- 10ms
- 1ms
- 2.5ms
- 2ms
- 3.5ms
- 3ms
- 4ms
- Clock Frequency (fc)
- 20MHz
- 33MHz
- 40MHz
- 50MHz
- 83MHz
- 100MHz
- 104MHz
- 108MHz
- 133MHz
- 208MHz
- 533MHz
- Interface Type
- Parallel Port
- SD2.0
- SD3.0
- SPI
- UFS
- UFS2.1
- UFS2.2
- 并口(Parallel)
- Memory Size
- 128Gbit
- 128Mbit
- 160Gbit
- 16Gbit
- 16Mbit
- 1Gbit
- 1Tbit
- 256Gbit
- 256Mbit
- 2Gb (256M x 8)
- 2Gbit
- 2Mbit
- 2Tbit
- 320Gbit
- 32Gbit
- 384Gbit
- 40Gbit
- 4Gbit
- 4Tbit
- 512Gbit
- Operating Temperature
- -25℃~+85℃
- -30℃~+85℃
- -40℃~+105℃
- -40℃~+85℃
- -40℃~+95℃
- 0℃~+70℃
- Page Program time (Tprog)
- 0.35ms
- 200us
- 220us
- 250us
- 300us
- 360us
- 700us
- Standby supply current
- 200uA
- Supply Current (Erase)
- 15mA
- Supply Current (Program)
- 30mA
- Supply Current (Read)
- 15mA
- 30mA
- Supply Voltage
- 1.65V~1.95V
- 1.65V~3.6V
- 1.7V~1.95V
- 1.7V~1.98V
- 1.8V
- 1.8V;3.3V
- 1.8V~3.3V
- 2.4V~2.7V
- 2.5V~3.6V
- 2.7V
- 2.7V~3.6V
- 3V~3.6V
- 3.3V
- Write Cycle Time (tWC)
- 20ns
- 250us
- 25ns
- 35ns
- 45ns
- 600us
- 700us
- 70us
Quantity
-
New look survey
2027 items in total
- 1
- 2
- 3
- 4
- 5
- 6
- 82