H9HCNNNCPMMLXR-NEE

Manufacturer

SK HYNIX

MFR.Part #

H9HCNNNCPMMLXR-NEE

JLCPCB Part #

C19192462

Package

BGA-200

Description

BGA-200 DRAM ROHS

EasyEDA Libraries

PCB Footprint or Symbol

ECCN

-

Datasheet

Download

Source

JLCPCB

Assembly Type

SMT Assembly

A PCB assembly fixture is needed to protect and support this part during the assembly process.

PCBA Type

Standard Only

Due to limits in package (0201), temperature and other certain conditions, this part is only available for Standard PCBA service.

MSL Level

Moisture Sensitivity Level (MSL) ratings range from 1 to 6, with MSL 6 being the most sensitive. Normally,components with MSL ratings of 5 or higher require baking to prevent damage from absorbed moisture during reflow soldering. Learn More>

MSL 3

X-ray Inspection

In order to ensure the soldering quality, X-ray inspection is required for components, like BGA, QFN, or other lead-less package types, whose soldering joints are hidden after assembly.

Required