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Simplify SMT Assembly with Custom PCB Stencils

Blog  /  Simplify SMT Assembly with Custom PCB Stencils

Simplify SMT Assembly with Custom PCB Stencils

May 30, 2025

Surface Mount Technology (SMT) assembly is a cornerstone of modern electronics manufacturing. From compact smartphones to industrial control systems, SMT ensures efficient placement of electronic components on printed circuit boards (PCBs). However, achieving precise solder paste application, a critical step in SMT, can be challenging without the right tools. This is where custom PCB stencils come into play, simplifying the assembly process and ensuring consistent, high-quality results. Let’s explore how custom stencils enhance SMT assembly and why they are indispensable for PCB manufacturers. Stencils offer several advantages here are the few key points, why to use stencil for PCBA:



Precise Solder Paste Application


Improved Assembly Speed


Enhanced Solder Joint Reliability


Compatibility with Automation



The Role of PCB Stencils in SMT Assembly



PCB stencils are thin sheets, typically made from stainless steel or polyimide, designed to precisely deposit solder paste onto PCB pads. During SMT assembly, the stencil acts as a template that aligns with the PCB layout, ensuring accurate solder paste application. Properly applied solder paste is crucial as it serves as an adhesive and conductive medium for placing and soldering surface-mount components.



Custom PCB stencils, tailored to the unique specifications of a PCB design, take this process a step further by ensuring even greater precision and efficiency. Unlike generic stencils, custom stencils are specifically designed to match the exact pad layouts, component sizes, and spacing of your PCB.



Types of SMT Stencils in PCB Assembly:



JLCPCB offers two types of stencils to cater to different soldering processes.


Framed Stencil:

Framed PCB stencils are mostly ready to use. Framed stencil consists of a normal laser cut stencil sheet stained to the metal frame. This type of stencil is most suitable for high-volume SMT assembly due to the frame's ability to provide better stability and reusability of the stencil itself.


Non-Framed Stencil:

The non-framed stencil is commonly used for hand soldering and provides the flexibility to customize stencil sizes and select other parameters based on your specific requirements. This design allows for the direct placement of the stencil onto the PCB and it’s mostly suitable for hobby and non repeatable usage. Frameless stencils are very light which makes them great for shipping.


The frame of the stencil also allows a better and faster process of alignment between the PCB and stencil. The cost of the frame stencil is relatively higher due to the need for additional frame support. Moreover, frameworks require additional storage space and can be more complex to manage. It also makes stencil heavier, increasing shipping costs.



Step Stencil:

There are various components on the PCB, and each component has different solder paste requirements during the soldering process. Regular laser stencils can only regulate the amount of solder paste by adjusting the size of the openings while overall thickness of the stencil is the same everywhere.



In order to meet higher standards and requirements for soldering effectiveness and quality, some engineers require multiple solder paste thicknesses on the same SMT template to achieve precise control of the solder paste amount. This requirement leads to the use of a step stencil. It allows for printing varying solder paste thicknesses on the same stencil, enabling precise control of the solder volume.



Key Features of Custom PCB Stencils



1. Material Selection: Custom stencils are commonly made from stainless steel, which offers durability and precision. For specialized applications, polyimide stencils may be used, offering flexibility and compatibility with certain solder paste types.



2. Laser-Cut Apertures: High-precision laser cutting ensures that stencil apertures are accurately sized and shaped to match the PCB design. This precision minimizes paste bleed and ensures optimal paste deposition.



3. Step-Up and Step-Down Areas: Custom stencils can include step-up or step-down areas to accommodate components with varying solder paste volume requirements. This feature is particularly useful for mixed technology boards.



4. Alignment Features: Alignment holes and fiducial marks are added to custom stencils to ensure perfect registration with the PCB during the solder paste application process.



The Custom Stencil Design Process



Creating a custom PCB stencil involves a series of steps to ensure it meets the specific requirements of your design:



1. PCB Design Analysis: Manufacturers analyze the PCB Gerber files to understand the layout, pad dimensions, and component placement.



2. Stencil Aperture Design: Based on the analysis, stencil apertures are designed to achieve optimal solder paste deposition for each pad.



3. Material Selection: The appropriate material is chosen based on factors like stencil size, paste type, and application.



4. Laser Cutting: High-precision lasers cut the apertures into the stencil material.



5. Quality Inspection: The stencil undergoes thorough inspection to ensure it matches the design specifications and is free from defects.



Ordering a Custom-size Frameless Stencil:



1. The custom stencil size should be within the valid area of the stencil for each specific model. For example, the valid area for a 380*280mm model stencil is 290*190mm. Therefore, the custom stencil size for this model must be within 290*190mm.


2. We recommend choosing a custom stencil size larger than your PCB outline to ensure proper coverage and alignment during the printing process. If you have any specific requirement, please mention it in Stencil Remark.


In JLCPCB, you have two options for ordering stencils. You can either choose to order a stencil together with the PCB or order the stencil separately.



Tips for Using Custom PCB Stencils



1. Ensure Proper Alignment: Align the stencil accurately with the PCB using fiducial markers to prevent misapplication of solder paste.



2. Maintain Cleanliness: Regularly clean the stencil to remove solder paste residues and ensure consistent performance.



3. Use High-Quality Paste: Pair your custom stencil with high-quality solder paste for optimal results.



4. Calibrate Stencil Printers: Ensure your stencil printer is calibrated for precise paste deposition.


Conclusion



Custom PCB stencils are essential for achieving precision, efficiency, and reliability in Surface Mount Technology (SMT) assembly. By ensuring accurate solder paste application, they reduce defects, enhance production speed, and improve overall yield. Whether using framed, non-framed, or step stencils, manufacturers can tailor the stencil design to meet specific PCB requirements, optimizing the assembly process.



By leveraging custom PCB stencils, manufacturers can streamline their production process, reduce rework costs, and achieve consistent, high-quality solder joints. As SMT technology continues to evolve, the role of custom stencils in ensuring precise, automated, and cost-effective assembly will remain crucial.